Coordinating measuring machine (CMM) probes are transducers that convert physical measurements into electrical signals, using various measuring systems within the probe structure

Temperature instruments use contact or noncontact methods to measure temperature. Products include dial, digital, industrial and laboratory thermometers; temperature probes, indicators, and sensors; RTD elements and transmitters; and thermistors, thermocouples, thermopiles, and thermal switches. 

Position probes measure the position of a target surface, usually with a high degree of accuracy. This search form covers many different linear position products

Noncontact infrared temperature sensors absorb ambient infrared (IR) radiation given off by a heated surface. They are used in applications where direct temperature measurement is not possible.

Temperature sensors are measurement devices that infer temperature by sensing some physical characteristic (i.e. resistance, emf or thermal radiation).

Surface profilometers are contact or non-contact instruments used to measures surface profiles, roughness, waviness and other finish parameters

Wafer and thin film instrumentation includes quartz crystal microbalance (QCM) monitors, ellipsometers, RHEED systems, imaging stations, CD-SEMs, ion mills, and C-V systems specifically designed for wafer metrology or in-situ monitoring of thin film parameters during thin film or semiconductors wafer processing.

Linear position sensors, all types, is a general search form for all linear position / displacement detection product areas.

Semiconductor metrology instruments are designed for wafer and thin film in-line inspection after semiconductor processing. They include capacitance gages, C-V systems, electron beam probes, ellipsometers, interferometers, I-V system, magnetometers, optical systems, profilometers, reflectometers, resistance probes, RHEED systems, and X-ray diffractometers.  

Dimensional measurement and metrology services use mechanical gaging, CMM measurement, non-contact imaging or other specialized methods to inspect and measure part dimensions and geometry

Dimensional gages and instruments provide quantitative measurements of product or component dimensional and form attributes such as wall thickness, depth, height, length, inner diameter (ID), outer diameter (OD), taper or bore.

Surface metrology equipment is used to measure the surface finish and/or geometry of engineering components. Surface texture and topology characteristics include surface roughness, contour, form, waviness and defects.

Thickness gages are used to make precise dimensional measurements on a wide variety of coatings and materials including steel, plastic, glass, rubber, ceramics, paint, electroplated layers, enamels, etc

Fiber optic linear position sensors use fiber optic technology to sense position and displacement.

Ultrasonic instruments use beams of high frequency, short wave signals to inspect, monitor, and measure materials and components.